Intel SE7501HG2 - Technical Product Specification
Intel SE7501HG2 - Product Guide
Системная плата Intel SE7501HG2
| Features | Benefits |
| Support for one or two Intel. Xeon. Processor(s) with 512KB L2 cache with or without 1MB integrated L3 cache | Power, bandwidth, and processing performance to meet the demanding requirements of departmental loads |
| Intel. E7501 chipset | High-performance, quality, and improved memory reliability |
| Support for up to 12 GB of registered ECC DDR266 memory through six DIMM sockets | Memory flexibility with the price/performance advantage of DDR to support a wide range of solutions |
| Dual memory channel architecture | High-performance, high-reliability memory subsystem with up to 4.3 GB/sec of data transfer |
| Support for Intel. x4 Single Device Data Correction | Memory fault tolerance |
| Three independent PCI buses on six slots: one 64-bit/133MHz PCI-X, two 64-bit/100MHz PCI-X, and three PCI 32-bit/33MHz | Distributed I/O workload for boosting overall I/O throughput, flexibility, and scalability |
| Support for the Intel. RAID Controller SRCZCR | The ability to use low-cost RAID solutions through the server board.s integrated Ultra320 SCSI controller |
| Two integrated Intel. PRO1000+ Server Network Connections | Networking capabilities with widespread compatibility, scalable bandwidth, and redundant links |
| Integrated Adaptec* dual-channel Ultra320 SCSI controller with integrated mirroring and striping | High-performance storage options and enhanced data protection |
| Integrated ATI* Rage* XL SVGA PCI video controller with 8 MB of video memory | High-quality video without the loss of a PCI slot or the cost of adding a graphic card |
| Intel. Server Management including integrated in-band and out-of-band remote management and event alerting and logging; IPMI 1.5 compliant | Amplified security, troubleshooting, problem resolution, and maintenance |
E7501
Системный набор микросхем
(chipset)
Intel E7501
| Supports two Intel Xeon processors with 533 MHz system bus for DP-based server platforms | Delivers a platform that brings Intel NetBurst® microarchitecture and the Hyper-Threading Technology of the Intel Xeon processor to deliver world-class performance for peak server workloads. |
| 533 MHz system bus capability | Supports a high-performance platform by enabling a 4.3 GB/s system bus bandwidth that can support greater memory and I/O bandwidths. |
| Intel Hub Architecture 2.0 connection to the MCH | This point-to-point connection between the MCH and the three Intel 82870P2 Controller Hub devices provides greater than 1 GB/s of bandwidth. Error Correction Code (ECC) protection, coupled with high data transfer rates, supports I/O segments with greater reliability and faster access to high-speed networks. |
| Intel® 82870P2 Controller Hub | Introduces next-generation PCI/PCI-X performance and significantly enhances platform flexibility. Two independent 64-bit, 133 MHz PCI-X segments and two hot-plug controllers (one per segment) for each Intel 82870P2 Controller Hub device allow up to six PCI-X buses per system. |
| Dual-channel DDR-266 memory interface | Offers a maximum memory bandwidth of 4.3 GB/s through a 144-bit wide, 266 MHz Double Data Rate SDRAM memory interface with densities up to 512 megabits. |
| Advanced Platform RASUM | Features such as memory ECC with Intel® x4 Single Device Data Correction**, hardware memory scrubbing, MCH SMBus target interface, hub interface ECC, and the availability of enhanced error status information maintained through reset yield a more reliable platform. |
Pentium 4 Xeon
Pentium 4 0.13 micron die
Процессор Pentium 4 Xeon.
- Dual processing server/workstation support
- Binary compatible with applications running on previous members of Intel’s IA32 microprocessor line
- Intel ® NetBurst™ micro-architecture
- Hyper-Threading Technology —Hardware support for multithreaded applications
- 533 MHz System bus —Bandwidth up to 4.2 GB/second
- Rapid Execution Engine: Arithmetic Logic Units (ALUs) run at twice the processor core frequency
- Hyper Pipelined Technology
- Advance Dynamic Execution: very deep out-of-order execution, enhanced branch prediction
- Level 1 Execution Trace Cache stores 12 K micro-ops and removes decoder latency from main execution loops. Includes 8 KB Level 1 data cache
- 512 KB Advanced Transfer L2 Cache (on-die, full speed Level 2 cache) with 8-way associativity and Error Correcting Code (ECC)
- Enables system support of up to 64 GB of physical memory
- Streaming SIMD Extensions 2 (SSE2) . 144 new instructions for double-precision floating point operations, media/video streaming, and secure transactions
- Enhanced floating point and multimedia unit for enhanced video, audio, encryption, and 3D performance
- Power Management capabilities: System Management mode, multiple low-power states
- Advanced System Management Features: System
Management Bus,
Processor
Information ROM (PIROM), OEM Scratch EEPROM, Thermal Monitor,
- Machine Check Architecture (MCA)
Оперативная память
- 2 модуля 1024 MB DDR266 (PC2100) registered
ECC
DRAM, Transcend, chips Samsung 325 K4H5604380-TCB0
